Apraksts

• Type of board universal
• Board variant prototyping,  single sided
• Material epoxy resin reinforced with fiberglass,  FR4
• Laminate thickness 1mm
• Width 60mm
• Length 80mm
• Copper plating thickness 18µm
• Hole diameter 1mm
• Soldering pads pitch 0.7/2.54mm
• Soldering pads configuration
• 0805
• 1206
• MELF
• SMA
• SMB
• SMC
• SOD80
• SOD87
• SOT23
• SOT89
• SOT143
• SOT223
• SOT323
• Additional information
• Gross weight: 9 g

Parametri

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